This paper introduces a novel MEMS technology based audio module for in-ear headphone applications. The device has a small form factor with the whole audio module integrated inside the tip of an in-ear headphone. It is a complete audio solution containing a surface mounted MEMS speaker, an integrated audio amplifier with energy recovery, a digital MEMS microphone as well as digital signal processing for equalization and open-loop predistortion. The module can be manufactured in an SMT line enabling fully automated high-volume mass production with low costs and high yield. The mechanical structure and key benefits of a MEMS based speaker module are discussed in detail, along with the fundamentals of the audio amplifier implementation and signal processing.
Hänsler, Markus; Muraro, Giacomo; Novotny, Christian; Murphy, Richard; Murphy, Richard; Spötl, Jakob; Rusconi Clerici, Andrea
Affiliation: USound GmbH
AES Convention: 148 (May 2020) eBrief:577
Publication Date: May 28, 2020
Subject: Posters: Loudspeakers & Microphones
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