Thick film technology has been exploited in the development and manufacture of several new low power (1 watt) audio amplifiers in a hybrid integrated circuit form. This paper describes the merits and limitations of thick film hybrid techniques and discusses several practical amplifier circuits which demonstrate the application of this art.
Author:
Haas, George C.
Affiliation:
Motorola Semiconductor Products, Inc., Phoenix, AZ
AES Convention:
31 (October 1966)
Paper Number:
494
Publication Date:
October 1, 1966
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