AES Convention Papers Forum

Modelling of a Chip Scale Package on the Acoustic Behavior of a MEMS Microphone

Document Thumbnail

Micro-electro-mechanical system (MEMS) microphones have been widely used in the mobile devices in recent decades. The acoustic effects of a chip scale package on a MEMS microphone needs to be validated. Previously a lumped equivalent circuit model was adopted to analyze the acoustic frequency response of the package. However, such a theoretical model cannot predict performance at relatively high frequencies. In this paper a distributed parameter model was proposed to simulate the acoustic behavior of the MEMS microphone package. The model illustrates how the MEMS microphone acoustic transfer function is affected by the size of sound hole, the volumes of the front and back chamber. This model also can illustrate the mechanical response of the MEMS microphone. The proposed model provided a more reliable way towards an optimized MEMS package structure.

AES Convention: Paper Number:
Publication Date:

Click to purchase paper as a non-member or you can login as an AES member to see more options.

No AES members have commented on this paper yet.

Subscribe to this discussion

RSS Feed To be notified of new comments on this paper you can subscribe to this RSS feed. Forum users should login to see additional options.

Start a discussion!

If you would like to start a discussion about this paper and are an AES member then you can login here:

If you are not yet an AES member and have something important to say about this paper then we urge you to join the AES today and make your voice heard. You can join online today by clicking here.

AES - Audio Engineering Society